Electronic Packaging design includes packaging of chassis, enclosures, mother and daughter board definition, including thermal design and airflow/cooling characteristics.  

We can assist with printed circuit layout by developing the mechanical definition of the board, connector placements, mounting hole locations and keep out areas.  Progress engineers will develop rack mounted enclosures and custom enclosures; both metal and plastic molded are designed with consideration for EMI/RFI requirements. 

Our engineers can manage your designs ideas using our expertise in manufacturing technologies; surface mount and thru-hole, rigid, flexible and rigid-flex printed circuitry as well as advanced interconnect technologies to create the most cost effective design using the most appropriate manufacturing processes.

Our capabilities include:

• Sheet Metal Chassis Design
• Plastic Enclosures
• Printed Circuit Board Mechanical Definition
• Mil-Spec and IPC Standards
• Flexible Circuit Design
• Harness and Cabling
• Design Documentation